UV curing system is an equipment to ease of peeling UV-tape after UV exposure. The tape is UV tape for surface protection during back grinding and dicing tape in the process of the wafer processing.
This high-pressure Hg lamp type UV curing system uses a conventional UV lamp to achieve stable curing results.
Thanks to Technovision’s unique design, these compact systems ensure uniform exposures at lower temperatures. An N2 purge function uses significantly lower N2 volumes compared to existing systems.
These models improve the efficiency of the manufacturing process by reducing the system operating costs and minimizing use of valuable clean room floor space.
Model | Wafer/Frame size | Dimensions |
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UVC-408 | 200mm | 400mm(W) × 665mm(D) × 435mm(H) |
1 | Compact design. |
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2 | Uniform exposure while rotating the Workpiece. |
3 | Low temperature operation similar to that of a low-pressure lamp machine. |
4 | Features a low consumption N2 purge function. |