Select from a wide range of manual wafer mounter models to meet needs ranging from research and development to semi-custom production.
This manual wafer mounter series accommodates three workpiece sizes: 300 mm, 200 mm, and 150 mm.
These manual wafer mounter models can be manufactured for either dicing film mounting or back grind film mounting.
The products in this series of manual wafer mounters can be applied not only to wafers but also to packaging, glass, ceramic, and various other types of workpieces. They can also be customized to meet a wide range of user specifications.
< for Dicing process model >
| Model | Wafer/Frame size | Dimensions |
|---|---|---|
| FM-2243 | up to 12 inch | 510mm(W) x 860mm(D) x 330mm(H) |
| FM-2248 | up to 8 inch | 455mm(W) x 780mm(D) x 300mm(H) |
| FM-2246 | up to 6 inch | 375mm(W) x 760mm(D) x 230mm(H) |
< for Back Grind model >
| Model | Wafer size | Dimensions |
|---|---|---|
| FM-2243-BG | up to 12 inch | 510mm(W) x 860mm(D) x 330mm(H) |
| FM-2248-BG | up to 8 inch | 455mm(W) x 780mm(D) x 300mm(H) |
| FM-2246-BG | up to 6 inch | 375mm(W) x 760mm(D) x 230mm(H) |
| 1 | Instantaneous bubble-free mounting |
| 2 | Built-in automatic balancing mechanism for mounting roller |
| 3 | Built-in circular cutter |
| 4 | Built-in horizontal cutter |
| 5 | Built-in separator winding mechanism |
| 6 | Customization available |
< for Dicing process >
FM-224 series
< for Back Grind process >
FM-224-BG series
< others >
Customization is available for other usage e.g. DAF process, DFR prcess etc.